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NCP699SN30T1G Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza
componentes Descripción
Fabricante
NCP699SN30T1G
ON-Semiconductor
ON Semiconductor ON-Semiconductor
NCP699SN30T1G Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
NCP699
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PIN FUNCTION DESCRIPTION
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PinNo. PinName
Description
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 1
Vin
Positive power supply input voltage.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 2
Gnd
Power supply ground.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 3
Enable
This input is used to place the device into lowpower standby. When this input is pulled low, the device is
disabled. If this function is not used, Enable should be connected to Vin.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 4
N/C
No internal connection.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 5
Vout
Regulated output voltage.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage
Vin
2.1 to 6.0
V
Enable Voltage
Enable
0.3 to Vin +0.3
V
Output Voltage
Vout
0.3 to Vin +0.3
V
Power Dissipation
PD
Internally Limited
W
Operating Junction Temperature
TJ
+150
°C
Maximum Junction Temperature
TJ(max)
+150
°C
Operating Ambient Temperature
TA
40 to +85
°C
Storage Temperature
Tstg
55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MILSTD883, Method 3015
Machine Model Method 200 V
2. Latchup capability (85°C) "200 mA DC with trigger voltage.
THERMAL CHARACTERISTICS
Rating
JunctiontoAmbient
PSIJLead 2
Symbol
RqJA
YJL2
Test Conditions
1 oz Copper Thickness, 100 mm2
1 oz Copper Thickness, 100 mm2
Typical Value
250
68
Unit
°C/W
°C/W
NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following
boundary conditions as stated in EIA/JESD 511, 2, 3, 7, 12.
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