NCP4587(2010) Ver la hoja de datos (PDF) - ON Semiconductor
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NCP4587 Datasheet PDF : 8 Pages
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NCP4587
PACKAGE DIMENSIONS
D
PIN ONE
ÍÍÍ REFERENCE
ÍÍÍÍÍÍ 2X
0.05 C
2X
0.05 C TOP VIEW
0.05 C
XDFN6 1.2x1.2, 0.4P
CASE 711AA−01
ISSUE O
A
B
E
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25mm FROM TERMINAL TIPS.
4. COPLANARITY APPLIES TO ALL OF THE
TERMINALS.
MILLIMETERS
DIM MIN MAX
A --- 0.40
A1 0.00 0.05
b 0.13 0.23
C 0.20 0.30
D
1.20 BSC
E
1.20 BSC
e
0.40 BSC
L 0.37 0.48
0.05 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
e
1
3
C
RECOMMENDED
MOUNTING FOOTPRINT*
6X 0.22
6X
0.66
PACKAGE
OUTLINE
1.50
6X L
6
4
BOTTOM VIEW
6X b
0.05 M C A B
NOTE 3
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
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