NCP4587(2010) Ver la hoja de datos (PDF) - ON Semiconductor
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NCP4587 Datasheet PDF : 8 Pages
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NCP4587
APPLICATION INFORMATION
A typical application circuit for NCP4587 series is shown
in Figure 3.
VIN
C1
1m
NCP4587x
VIN
VOUT
CE
AE
GND
VOUT
C2
1m
Figure 3. Typical Application Schematic
is above logic high level. Enable pin has internal pull down
current source. If enable function is not needed connect CE
pin to VIN.
Output Discharger
The D version includes a transistor between VOUT and
GND that is used for faster discharging of the output
capacitor. This function is activated when the IC goes into
disable mode.
Auto ECO and Fast Mode
The NCP4587 has two operation modes that have impact
on supply current and transient response at low output
current. These two modes can be selected by AE pin. If AE
pin is at low level Auto ECO mode is available. Please, see
supply current vs. output current charts.
Input Decoupling Capacitor (C1)
A 1 mF ceramic input decoupling capacitor should be
connected as close as possible to the input and ground pin of
the NCP4587. Higher values and lower ESR improves line
transient response.
Output Decoupling Capacitor (C2)
A 1 mF ceramic output decoupling capacitor is sufficient
to achieve stable operation of the IC. If tantalum capacitor
is used, and its ESR is high, the loop oscillation may result.
If output capacitor is composed from few ceramic capacitors
in parallel, the operation can be unstable. The capacitor
should be connected as close as possible to the output and
ground pin. Larger values and lower ESR improves dynamic
parameters.
Enable Operation
Enable pin CE may be used for turning the regulator on
and off. The regulator is switched on when CE pin voltage
Thermal
As power across the IC increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature rise for the part.
That is to say, when the device has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation applications.
PCB layout
Make VIN and GND line sufficient. If their impedance is
high, noise pickup or unstable operation may result. Connect
capacitors C1 and C2 as close as possible to the IC, and make
wiring as short as possible.
ORDERING INFORMATION
Device
Nominal Output
Voltage
Description
Marking
Package
Shipping†
NCP4587DMU12TCG
1.2 V
Auto discharge
YE
XDFN
5000 / Tape & Reel
(Pb−Free)
NCP4587DMU18TCG
1.8 V
Auto discharge
YL
XDFN
5000 / Tape & Reel
(Pb−Free)
NCP4587DMU28TCG
2.8 V
Auto discharge
YW
XDFN
5000 / Tape & Reel
(Pb−Free)
NCP4587DMU30TCG
3.0 V
Auto discharge
YY
XDFN
5000 / Tape & Reel
(Pb−Free)
NCP4587DMU33TCG
3.3 V
Auto discharge
ZB
XDFN
5000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NOTE: To order other package and voltage variants, please contact your ON Semiconductor sales representative.
http://onsemi.com
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