NCP382HMN15AATXG(2012) Ver la hoja de datos (PDF) - ON Semiconductor
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NCP382HMN15AATXG Datasheet PDF : 12 Pages
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NCP382
PACKAGE DIMENSIONS
DFN8, 3x3, 0.65P
CASE 506BW
ISSUE O
D
A
B
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉÉÉÉÉÉÉ
E
2X
0.10 C TOP VIEW
0.05 C
DETAIL B
(A3)
0.05 C
NOTE 4
SIDE VIEW A1
DETAIL A
D2
1
4
8X L
L
L
L1
DETAIL A
OPTIONAL
CONSTRUCTIONS
ÉÉÉÉ EXPOSED Cu
MOLD CMPD
A
DETAIL B
OPTIONAL
CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.25 0.35
D 3.00 BSC
D2 2.30 2.50
E 3.00 BSC
E2 1.55 1.75
e 0.65 BSC
K 0.20 −−−
L 0.35 0.45
L1 0.00 0.15
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
ÇÇÇÇÇÇÇÇÇÇÇÇ 2.50
8X
0.62
E2
8X K
8
5
e/2
e
BOTTOM VIEW
8X b
0.10 C A B
0.05 C NOTE 3
1.75
3.30
ÇÇ1ÇÇÇÇÇÇÇÇÇÇ8X
0.65
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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