NCP3020A Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza

componentes Descripción

Fabricante

NCP3020A

Synchronous PWM Controller

ON Semiconductor 

NCP3020A, NCP3020B, NCV3020A, NCV3020B

ABSOLUTE MAXIMUM RATINGS (measured vs. GND pin 8, unless otherwise noted)

High Side Drive Boost Pin

Rating

Symbol

BST

VMAX

45

VMIN

−0.3

Unit

V

Boost to VSW differential voltage

BST−VSW

13.2

−0.3

V

COMP

COMP

5.5

−0.3

V

Feedback

High−Side Driver Output

Low−Side Driver Output

Main Supply Voltage Input

Switch Node Voltage

Maximum Average Current

VCC, BST, HSDRV, LSDRV, VSW, GND

Operating Junction Temperature Range (Note 1)

Maximum Junction Temperature

Storage Temperature Range

Thermal Characteristics (Note 2)

SOIC−8 Plastic Package

Thermal Resistance Junction−to−Air

Lead Temperature Soldering (10 sec): Reflow (SMD styles only) Pb−Free

(Note 3)

FB

HSDR

LSDR

VCC

VSW

Imax

TJ

TJ(MAX)

Tstg

RqJA

RF

5.5

−0.3

V

40

−0.3

V

13.2

−0.3

V

40

−0.3

V

40

−0.6

V

mA

130

−40 to +140

°C

+150

°C

−55 to +150

°C

165

260 Peak

°C/W

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. The maximum package power dissipation limit must not be exceeded.

TJ(max) * TA

PD +

RqJA

2. When mounted on minimum recommended FR−4 or G−10 board

3. 60−180 seconds minimum above 237°C.

http://onsemi.com

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