NCP3012 Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza

componentes Descripción

Fabricante

NCP3012

Synchronous PWM Controller

ON Semiconductor 

NCP3012

ABSOLUTE MAXIMUM RATINGS (measured vs. GND pin 8, unless otherwise noted)

High Side Drive Boost Pin

Rating

Symbol

BST

VMAX

45

VMIN

−0.3

Unit

V

Boost to VSW differential voltage

COMP

BST−VSW

13.2

−0.3

V

COMP

5.5

−0.3

V

Enable

EN

5.5

−0.3

V

Feedback

FB

5.5

−0.3

V

High−Side Driver Output

HSDR

40

−0.3

V

Low−Side Driver Output

LSDR

13.2

−0.3

V

Power Good

PG

5.5

−0.3

V

Synchronization

SYNC

5.5

−0.3

V

Main Supply Voltage Input

External Reference

VCC

VREF

40

−0.3

V

5.5

−0.3

V

Switch Node Voltage

Maximum Average Current

VCC, BST, HSDRV, LSDRV, VSW, GND

REF

EN

SYNC

PG

VSW

Imax

40

−0.6

V

mA

130

7.1

2.5

11

4

Operating Junction Temperature Range (Note 1)

Maximum Junction Temperature

Storage Temperature Range

Thermal Characteristics (Note 2)

TSSOP−14 Plastic Package

Thermal Resistance Junction−to−Air

Lead Temperature Soldering (10 sec): Reflow (SMD styles only) Pb−Free

(Note 3)

TJ

TJ(MAX)

Tstg

RqJA

RF

−40 to +140

+150

−55 to +150

190

260 Peak

°C

°C

°C

°C/W

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. The maximum package power dissipation limit must not be exceeded.

TJ(max) * TA

PD +

RqJA

2. When mounted on minimum recommended FR−4 or G−10 board

3. 60−180 seconds minimum above 237°C.

http://onsemi.com

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