NCL30002 Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza

componentes Descripción

Fabricante

NCL30002

Power Factor Corrected Buck LED Driver

ON Semiconductor 

NCL30002

Table 2. MAXIMUM RATINGS

Rating

Symbol

Value

Unit

MFP Voltage

VMFP

−0.3 to 10

V

MFP Current

IMFP

±10

mA

COMP Voltage

VControl

−0.3 to 6.5

V

COMP Current

IControl

−2 to 10

mA

Ct Voltage

VCt

−0.3 to 6

V

Ct Current

ICt

±10

mA

CS Voltage

VCS

−0.3 to 6

V

CS Current

ICS

±10

mA

ZCD Voltage

VZCD

−0.3 to 10

V

ZCD Current

IZCD

±10

mA

DRV Voltage

VDRV

−0.3 to VCC

V

DRV Sink Current

IDRV(sink)

800

mA

DRV Source Current

IDRV(source)

500

mA

Supply Voltage

VCC

−0.3 to 20

V

Supply Current

ICC

Power Dissipation (TA = 70°C, 2.0 Oz Cu, 55 mm2 Printed Circuit Copper Clad)

PD

±20

mA

450

mW

Thermal Resistance Junction−to−Ambient

(2.0 Oz Cu, 55 mm2 Printed Circuit Copper Clad)

Junction−to−Air, Low conductivity PCB (Note 3)

Junction−to−Air, High conductivity PCB (Note 4)

RqJA

RqJA

RqJA

°C/W

178

168

127

Operating Junction Temperature Range

TJ

−40 to 125

°C

Maximum Junction Temperature

TJ(MAX)

150

°C

Storage Temperature Range

TSTG

−65 to 150

°C

Lead Temperature (Soldering, 10 s)

TL

300

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests:

Pins 1– 8: Human Body Model 2000 V per JEDEC Standard JESD22−A114E.

Pins 1– 8: Machine Model Method 200 V per JEDEC Standard JESD22−A115−A.

2. This device contains Latch−Up protection and exceeds ± 100 mA per JEDEC Standard JESD78.

3. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 80 mm2 of 2 oz copper traces and heat spreading area. As specified

for a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow.

4. As mounted on a 40 x 40 x 1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified

for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow.

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