NBSG111(2007) Ver la hoja de datos (PDF) - ON Semiconductor
Número de pieza
componentes Descripción
Fabricante
NBSG111
(Rev.:2007)
(Rev.:2007)
ON Semiconductor
NBSG111 Datasheet PDF : 11 Pages
| |||
NBSG111
Table 4. ATTRIBUTES
Characteristics
Internal Input Pulldown Resistor, R2
(CLK0, CLK0, CLK1, CLK1, SEL, SEL, EN, EN)
Internal Input Pullup Resistor, R1 (CLK0, CLK1, SEL, EN)
ESD Protection
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity (Note 3)
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
3. For additional information, see Application Note AND8003/D.
Value
75 kW
36.5 kW
> 2 kV
> 100 V
> 1 kV
Level 3
UL 94 V−0 @ 0.125 in
479
Table 5. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
VCC
VI
VEE
VINPP
IOUT
Positive Power Supply
Positive Input
Negative Input
Negative Power Supply
Differential Input Voltage |CLK − CLK|
Output Current
VEE = 0 V
VEE = 0 V
VCC = 0 V
VCC = 0 V
VCC − VEE w 2.8 V
VCC − VEE t 2.8 V
Continuous
Surge
VI VCC
VI VEE
3.6
V
3.6
V
−3.6
V
−3.6
V
2.8
V
|VCC − VEE|
V
25
mA
50
mA
IIN
Input Current Through RT (50 W Resistor) Static
Surge
45
mA
80
mA
IBB
VBB Sink/Source
IMM
VMM Sink/Source
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient) 0 LFPM
(Note 4)
500 LFPM
49 FCBGA
49 FCBGA
1
1
−40 to +70
−65 to +150
67
57
mA
mA
°C
°C
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case) 2S2P (Note 4)
49 FCBGA
2 to 4
°C/W
Tsol
Wave Solder
< 15 sec.
225
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. JEDEC standard 51−6, multilayer board − 2S2P (2 signal, 2 power).
http://onsemi.com
5
Share Link: