DTC113EE(2015) Ver la hoja de datos (PDF) - ON Semiconductor
Número de pieza
componentes Descripción
Fabricante
DTC113EE Datasheet PDF : 12 Pages
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MUN2230, MMUN2230L, MUN5230, DTC113EE, DTC113EM3, NSBC113EF3
PACKAGE DIMENSIONS
−E−
2
3
1
b 3 PL
0.20 (0.008) M D
C
L
SC−75/SOT−416
CASE 463
ISSUE F
e −D−
HE 0.20 (0.008) E
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
MILLIMETERS
DIM MIN NOM MAX
A 0.70 0.80 0.90
A1 0.00 0.05 0.10
b 0.15 0.20 0.30
C 0.10 0.15 0.25
D 1.55 1.60 1.65
E 0.70 0.80 0.90
e
1.00 BSC
L 0.10 0.15 0.20
HE 1.50 1.60 1.70
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
INCHES
MIN NOM MAX
0.027 0.031 0.035
0.000 0.002 0.004
0.006 0.008 0.012
0.004 0.006 0.010
0.059 0.063 0.067
0.027 0.031 0.035
0.04 BSC
0.004 0.006 0.008
0.061 0.063 0.065
SOLDERING FOOTPRINT*
0.356
0.014
1.803
0.071
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
ǒ mm Ǔ
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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