DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

128M16 Ver la hoja de datos (PDF) - Micron Technology

Número de pieza
componentes Descripción
Fabricante
128M16
Micron
Micron Technology Micron
128M16 Datasheet PDF : 211 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
2Gb: x4, x8, x16 DDR3 SDRAM
Features
Table 51: DDR3-1066 Speed Bins ................................................................................................................... 71
Table 52: DDR3-1333 Speed Bins ................................................................................................................... 72
Table 53: DDR3-1600 Speed Bins ................................................................................................................... 73
Table 54: DDR3-1866 Speed Bins ................................................................................................................... 74
Table 55: DDR3-2133 Speed Bins ................................................................................................................... 75
Table 56: Electrical Characteristics and AC Operating Conditions .................................................................... 76
Table 57: Electrical Characteristics and AC Operating Conditions for Speed Extensions .................................... 86
Table 58: Command and Address Setup and Hold Values Referenced – AC/DC-Based ...................................... 96
Table 59: Derating Values for tIS/tIH – AC175/DC100-Based ............................................................................ 97
Table 60: Derating Values for tIS/tIH – AC150/DC100-Based ............................................................................ 97
Table 61: Derating Values for tIS/tIH – AC135/DC100-Based ............................................................................ 98
Table 62: Derating Values for tIS/tIH – AC125/DC100-Based ............................................................................ 98
Table 63: Minimum Required Time tVAC Above VIH(AC) or Below VIL(AC)for Valid Transition ............................... 99
Table 64: DDR3 Data Setup and Hold Values at 1 V/ns (DQS, DQS# at 2 V/ns) – AC/DC-Based ......................... 104
Table 65: Derating Values for tDS/tDH – AC175/DC100-Based ........................................................................ 105
Table 66: Derating Values for tDS/tDH – AC150/DC100-Based ........................................................................ 105
Table 67: Derating Values for tDS/tDH – AC135/DC100-Based at 1V/ns ........................................................... 106
Table 68: Derating Values for tDS/tDH – AC135/DC100-Based at 2V/ns ........................................................... 107
Table 69: Required Minimum Time tVAC Above VIH(AC) (Below VIL(AC)) for Valid DQ Transition ......................... 108
Table 70: Truth Table – Command ................................................................................................................. 113
Table 71: Truth Table – CKE .......................................................................................................................... 115
Table 72: READ Command Summary ............................................................................................................ 117
Table 73: WRITE Command Summary .......................................................................................................... 117
Table 74: READ Electrical Characteristics, DLL Disable Mode ......................................................................... 123
Table 75: Write Leveling Matrix ..................................................................................................................... 127
Table 76: Burst Order .................................................................................................................................... 136
Table 77: MPR Functional Description of MR3 Bits ........................................................................................ 146
Table 78: MPR Readouts and Burst Order Bit Mapping ................................................................................... 147
Table 79: Self Refresh Temperature and Auto Self Refresh Description ............................................................ 179
Table 80: Self Refresh Mode Summary ........................................................................................................... 179
Table 81: Command to Power-Down Entry Parameters .................................................................................. 180
Table 82: Power-Down Modes ....................................................................................................................... 181
Table 83: Truth Table – ODT (Nominal) ......................................................................................................... 191
Table 84: ODT Parameters ............................................................................................................................ 191
Table 85: Write Leveling with Dynamic ODT Special Case .............................................................................. 192
Table 86: Dynamic ODT Specific Parameters ................................................................................................. 193
Table 87: Mode Registers for RTT,nom ............................................................................................................. 193
Table 88: Mode Registers for RTT(WR) ............................................................................................................. 194
Table 89: Timing Diagrams for Dynamic ODT ................................................................................................ 194
Table 90: Synchronous ODT Parameters ........................................................................................................ 199
Table 91: Asynchronous ODT Timing Parameters for All Speed Bins ............................................................... 204
Table 92: ODT Parameters for Power-Down (DLL Off ) Entry and Exit Transition Period ................................... 206
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf - Rev. Q 04/13 EN
10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
‹ 2006 Micron Technology, Inc. All rights reserved.

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]