MSS50-800 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

MSS50-800

Back to back SCR module

STMicroelectronics 

MSS40, MSS50

3

Package information

Package information

● Epoxy meets UL94, V0

● Cooling method: by conduction (C)

● Recommended torque value: 0.9 Nm (max. 1.2 Nm) for the 6 x M4 screws (2 x M4

screws recommended for mounting the package on the heatsink and the 4 provided

screws).

● The screws supplied with the package are adapted for mounting on a board (or other

types of terminals) with a thickness of 0.6 mm min. and 2.2 mm max.

Table 6. ISOTOP dimensions

Dimensions

Ref.

Millimeters

Inches

E

) G2

Product(s A A1

E2

F1 F

solete P1

Ob D S

solete Product(s) - B

ØP

G1

E1

C

C2

G D1

Min. Max. Min. Max.

A 11.80 12.20 0.465 0.480

A1

8.90

9.10 0.350 0.358

B

7.8

8.20 0.307 0.323

C

0.75

0.85 0.030 0.033

C2

1.95

2.05 0.077 0.081

D 37.80 38.20 1.488 1.504

D1 31.50 31.70 1.240 1.248

E 25.15 25.50 0.990 1.004

E1 23.85 24.15 0.939 0.951

E2

24.80 typ.

0.976 typ.

G 14.90 15.10 0.587 0.594

G1 12.60 12.80 0.496 0.504

G2

3.50

4.30 0.138 0.169

F

4.10

4.30 0.161 0.169

F1

4.60

5.00 0.181 0.197

P

4.00

4.30 0.157 0.69

P1

4.00

4.40 0.157 0.173

S 30.10 30.30 1.185 1.193

Ob In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

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