MPXV53GC6U Ver la hoja de datos (PDF) - Motorola => Freescale
Número de pieza
componentes Descripción
Fabricante
MPXV53GC6U Datasheet PDF : 8 Pages
| |||
TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPX53/MPXV53GC series over temperature.
The piezoresistive pressure sensor element is a semicon-
ductor device which gives an electrical output signal propor-
tional to the pressure applied to the device. This device uses
a unique transverse voltage diffused semiconductor strain
gauge which is sensitive to stresses produced in a thin sili-
con diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differ-
ences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
MPX53 MPXV53GC SERIES
or by designing your system using the MPX2053 series
sensors.
Several approaches to external temperature compensa-
tion over both –40 to +125°C and 0 to +80°C ranges are
presented in Motorola Applications Note AN840.
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (see Figure 3). There are two basic methods
for calculating nonlinearity: (1) end point straight line fit or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motoro-
la’s specified pressure sensor linearities are based on the
end point straight line method measured at the midrange
pressure.
100
90
80
70
60
50
40
30
20
10
0
PSI 0
kPa 0
MPX53
VS = 3 Vdc
P1 > P2
-ā40°C
+ā25°C
+ā125°C
SPAN
RANGE
(TYP)
1
2
3
10
20
4
5
6
30
40
PRESSURE DIFFERENTIAL
OFFSET
(TYP)
7
8
50
Figure 2. Output versus Pressure Differential
70
60
LINEARITY
50
ACTUAL
40
30
20
THEORETICAL
SPAN
(VFSS)
10
OFFSET
0
(VOFF)
0
MAX
POP
PRESSURE (kPA)
Figure 3. Linearity Specification Comparison
ÉÉÉÉÉÉÉÉÉÉÉ WIRE BOND
SILICONE
DIE COAT
DIE
P1
STAINLESS STEEL
METAL COVER
EPOXY
CASE
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ LEAD FRAME
ÉÉÉÉÉÉÉÉÉÉÉ P2
RTV DIE
BOND
Figure 4. Cross–Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the unibody chip carrier (Case 344). A silicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX53/MPXV53GC series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor perfor-
mance and long term reliability. Contact the factory for in-
formation regarding media compatibility in your application.
Motorola Sensor Device Data
3
Share Link: 