MPX10 Ver la hoja de datos (PDF) - Freescale Semiconductor
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MPX10 Datasheet PDF : 9 Pages
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Wire Bond
Silicone
Die Coat
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Lead Frame
RTV Die
Bond
P2
Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX10 and MPXV10GC series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Part Number Case Type Pressure (P1) Side Identifier
MPX10D
344
Stainless Steep Cap
MPX10DP
344C Side with Part Marking
MPX10GP
344B Side with Port Attached
MPX10GS
344E Side with Port Attached
MPXV10GC6U
482A Side with Part Marking
MPXV10GC7U
482C Side with Part Marking
Sensors
Freescale Semiconductor
MPX10
5
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