MPC7447 Ver la hoja de datos (PDF) - Freescale Semiconductor
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MPC7447 Datasheet PDF : 60 Pages
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Package Description
8.2 Mechanical Dimensions for the MPC7448, 360 HCTE BGA
Figure 13 provides the mechanical dimensions and bottom surface nomenclature for the MPC7448, 360
HCTE BGA package.
A1 CORNER
D
D3
D1
D2
2X
0.2
B
Capacitor Region
0.15 A
NOTES:
1. Dimensioning and
tolerancing per ASME
Y14.5M, 1994
A 2. Dimensions in millimeters.
3. Top side A1 corner index is a
metalized feature with
various shapes. Bottom side
A1 corner is designated with
a ball missing from the array.
E3
E
E2
E1
E4
Millimeters
Dim Min Max
2X
0.2
C
e
D4
1 2 3 4 5 6 7 8 9 10 111213141516 171819
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
360X b
0.3 A B C
0.15 A
A3
A
0.35 A
A2
A1
A
2.32 2.80
A1 0.80 1.00
A2 0.70 0.90
A3
—
0.6
b
0.82 0.93
D
25.00 BSC
D1
— 11.3
D2
8.0
—
D3
—
6.5
D4
7.2
7.4
e
1.27 BSC
E
25.00 BSC
E1
— 11.3
E2
8.0
—
E3
—
6.5
E4
7.9
8.1
Figure 13. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7448,
360 HCTE BGA Package
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
30
Freescale Semiconductor
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