Pin Assignments
6 Pin Assignments
Figure 12 (in Part A) shows the pinout of the MPC7448, 360 high coefficient of thermal expansion ceramic
ball grid array (HCTE) package as viewed from the top surface. Part B shows the side profile of the HCTE
package to indicate the direction of the top surface view.
Part A
Part B
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Not to Scale
Substrate Assembly
View
Encapsulant
Die
Figure 12. Pinout of the MPC7448, 360 HCTE Package as Viewed from the Top Surface
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
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Freescale Semiconductor