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MPC7441

RISC Microprocessor Hardware Specifications

Freescale Semiconductor 

Pin Assignments

6 Pin Assignments

Figure 12 (in Part A) shows the pinout of the MPC7448, 360 high coefficient of thermal expansion ceramic

ball grid array (HCTE) package as viewed from the top surface. Part B shows the side profile of the HCTE

package to indicate the direction of the top surface view.

Part A

Part B

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B

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N

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Not to Scale

Substrate Assembly

View

Encapsulant

Die

Figure 12. Pinout of the MPC7448, 360 HCTE Package as Viewed from the Top Surface

MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

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Freescale Semiconductor

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