MPC17511AEV-EL Ver la hoja de datos (PDF) - Freescale Semiconductor

Número de pieza

componentes Descripción

Fabricante

MPC17511AEV-EL

1.0 A 6.8 V H-Bridge Motor Driver IC

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding the ratings may cause a malfunction or permanent

damage to the device.

Rating

Symbol

Value

Unit

Motor Supply Voltage

Charge Pump Output Voltage

Logic Supply Voltage

Signal Input Voltage (EN, IN1, IN2, GIN)

Driver Output Current

Continuous

Peak (1)

VM

VCRES

VDD

VIN

IO

IOPK

-0.5 to 8.0

V

-0.5 to 14.0

V

-0.5 to 7.0

V

-0.5 to VDD+0.5

V

A

1.0

3.0

ESD Voltage (2)

Human Body Model

Machine Model

VESD1

VESD2

V

±1800

± 100

Storage Temperature Range

Operating Ambient Temperature

Operating Junction Temperature

Thermal Resistance (3)

24 Pin QFN

16 Pin VMFP

Power Dissipation (4)

24 Pin QFN

16 Pin VMFP

Soldering Temperature (5)

Peak Package Reflow Temperature During Reflow (6), (7)

TSTG

TA

TJ

RθJA

PD

TSOLDER

TPPRT

-65 to 150

-20 to 65

-20 to 150

50

150

2500

830

260

Note 7

°C

°C

°C

°C/W

mW

°C

°C

Notes

1. TA = 25°C, 10 ms pulse width at 200 ms intervals.

2. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in

accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).

3. QFN24: 45 x 30 x 1 [mm] glass EPOXY board mount. (See: recommended heat pattern) VMFP16: 37 x 50 x 1.6 [mm] glass EPOXY

board mount. When the exposed pad is bonded, Rsj will not be performed.

4. Maximum at TA = 25°C. When the exposed pad is bonded, Rsj will not be performed.

5. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

Analog Integrated Circuit Device Data

Freescale Semiconductor

17511A

5

Share Link: