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1N3016BUR-1

Surface Mount 1.5 W GLASS ZENER DIODES

Microsemi Corporation 

SCOTTSDALE DIVISION

1N3016BUR-1 thru 1N3051BUR-1

(or MLL3016B thru MLL3051B)

Surface Mount 1.5 W

GLASS ZENER DIODES

DESCRIPTION

This surface mountable zener diode series is similar to the 1N3016 thru

1N3051 JEDEC registration in the DO-13 package except that it meets the

surface mount DO-213AB outline. It is an ideal selection for applications of

high density and low parasitic requirements. Due to its glass hermetic seal

qualities and metallurgically enhanced internal construction, it is also well

suited for high-reliability applications. This can be acquired by a source

control drawing (SCD), or by ordering device types with MQ, MX, or MV

prefix to part number for equivalent screening to JAN, JANTX or JANTXV.

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

APPEARANCE

DO-213AB

FEATURES

• Leadless surface mount package equivalents to the

JEDEC registered 1N3016 thru 1N3051 except with

higher power rating of 1.5 Watts

• Ideal for high-density mounting

• Voltage range: 6.8 to 200 volts

• Hermetically sealed, double-slug glass construction

• Metallurgically enhanced contact construction.

• Options for screening in accordance with MIL-PRF-

19500/115 for JAN, JANTX, JANTXV, and JANS

with MQ, MX, MV, or MSP prefixes respectively for

part numbers, e.g. MX1N3016BUR-1,

MV1N3051BUR-1, etc.

• Axial lead “thru-hole” DO-13 packages per JEDEC

registration available as 1N3016B thru 1N3051B

(see separate data sheet with MIL-PRF-19500/115

qualification)

APPLICATIONS / BENEFITS

• Regulates voltage over a broad operating current

and temperature range

• Wide selection from 6.8 to 200 V

• Tight voltage tolerances available

• Low reverse (leakage) currents

• Leadless package for surface mounting

• Ideal for high-density mounting

• Metallurgically enhanced internal contact design for

greater reliability and lower thermal resistance

• Nonsensitive to ESD

• Hermetically sealed glass package

• Specified capacitance (see Figure 2)

• Inherently radiation hard as described in Microsemi

MicroNote 050

MAXIMUM RATINGS

• Power dissipation at 25ºC: 1.5 watts (also see

derating in Figure 1).

• Operating and Storage temperature: -65ºC to

+175ºC

• Thermal Resistance: 40 ºC/W junction to end cap,

or 120ºC/W junction to ambient when mounted on

FR4 PC board (1 oz Cu) with recommended

footprint (see last page)

• Steady-State Power: 1.50 watts at end-cap

temperature TEC < 115oC, or 1.25 watts at TA = 25ºC

when mounted on FR4 PC board and

recommended footprint as described for thermal

resistance (also see Figure 1)

• Forward voltage @200 mA: 1.2 volts (maximum)

• Solder Temperatures: 260 ºC for 10 s (max)

MECHANICAL AND PACKAGING

• CASE: Hermetically sealed glass MELF package

• TERMINALS: Leads, tin-lead plated solderable per

MIL-STD-750, method 2026

• POLARITY: Cathode indicated by band. Diode to

be operated with the banded end positive with

respect to the opposite end for Zener regulation

• MARKING: Cathode band only

• TAPE & REEL optional: Standard per EIA-481-1-A

with 12 mm tape, 1500 per 7 inch reel or 5000 per

13 inch reel (add “TR” suffix to part number)

• WEIGHT: 0.05 grams

• See package dimensions on last page

Copyright  2002

11-03-2003 REV C

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

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