MLF1005L1R8K Ver la hoja de datos (PDF) - TDK Corporation

Número de pieza

componentes Descripción

Fabricante

MLF1005L1R8K

Multilayer/STD • magnetic shielded

TDK Corporation 

(1/9)

Inductors for Standard Circuits

Multilayer/STD • Magnetic Shielded

Conformity to RoHS Directive

MLF Series MLF1005L

Various digital devices are required to be further downsized yet

remain highly functional, and to excel in low power consumption,

and parts mounted on the devices are also required to have lower

resistance.

The MLF1005L type is a new line of inductors that have been

developed to meet such requirements: their resistance has been

lowered by up to 35% in comparison with that of the existing

MLF1005 type.

In addition, the new inductors use similar magnetic shielding,

which enables their high-density mounting.

FEATURES

• The resistance of the MLF1005L type has been lowered by up to

35% in comparison with that of the existing MLF1005 type.

• Magnetically shielded configuration allowing for high-density

mounting.

• Does not contain lead and is compatible with lead-free

soldering.

• It is a product conforming to RoHS directive.

APPLICATIONS

Signal processing modules such as cellular phones and tuners

SPECIFICATIONS

Operating temperature range

Storage temperature range

–40 to +85°C

–40 to +85°C(After mount)

RECOMMENDED SOLDERING CONDITION

REFLOW SOLDERING

250 to 260˚C

230˚C

10s max.

Natural

cooling

180˚C

150˚C

Preheating

60 to 120s

Time(s)

Soldering

30 to 60s

PRODUCT IDENTIFICATION

MLF 1005 L R10 K T

(1) (2) (3) (4) (5) (6) (7)

(1) Series name

(2) Dimensions L×W

1005

1.0×0.5×0.5

(3) Type name

L

Low-resistance type

(4) Inductance

R10

1R0

0.1µH

1.0µH

(5) Tolerance

K

±10%

(6) Packaging style

T

Taping [reel]

(7) TDK internal code

PACKAGING STYLE AND QUANTITIES

Packaging style

Taping

Quantity

10000 pieces/reel

HANDLING AND PRECAUTIONS

• Before soldering, be sure to preheat components.

The preheating temperature should be set so that the tempera-

ture difference between the solder temperature and product

temperature does not exceed 150°C.

• After mounting components onto the printed circuit board, do not

apply stress through board bending or mishandling.

• The inductance value may change due to magnetic saturation if

the current exceeds the rated maximum.

• Do not expose the inductors to stray magnetic fields.

• Avoid static electricity discharge during handling.

• When hand soldering, apply the soldering iron to the printed cir-

cuit board only. Temperature of the iron tip should not exceed

350°C. Soldering time should not exceed 3 seconds.

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

• Please contact our Sales office when your application is considered the following:

The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

• All specifications are subject to change without notice.

001-05 / 20111129 / e511_mlf_02

Share Link: