MHPM6B20E60D3 Ver la hoja de datos (PDF) - Motorola => Freescale

Número de pieza

componentes Descripción

Fabricante

MHPM6B20E60D3

Hybrid Power Module

Motorola => Freescale 

MHPM6B20E60D3

0.175

RECOMMENDED PCB LAYOUT

VIEW OF BOARD FROM HEAT SINK

(All Dimensions Typical)

NON–PLATED THRU–HOLE

0.140

0.265

KEEP–OUT ZONES (x4)

0.270

0.250

0.625

PIN 1

0.270

PLATED THRU–HOLES

(x16)

PACKAGE “SHADOW”

0.065

0.250 3.500

0.625

0.175

0.450

0.175

1.350

1.530

OPTIONAL NON–PLATED

THRU–HOLES FOR ACCESS

TO HEAT SINK MOUNTING

SCREWS (x2)

Figure 2. Package Footprint

NOTE:

1. Package is symmetrical, except for a polarizing plastic post near pin 1, indicated by a non–plated thru–hole in the footprint.

2. Dimension of plated thru–holes indicates net size after plating.

3. Access holes for mounting screws may or may not be necessary depending on assembly plan for finished product.

4

Motorola IGBT Device Data

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