MDD26 Ver la hoja de datos (PDF) - IXYS CORPORATION
Número de pieza
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MDD26 Datasheet PDF : 3 Pages
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MDD 26
Fig. 5 Three phase rectifier bridge:
Power dissipation versus direct
output current and ambient
temperature
Fig. 6 Transient thermal impedance
junction to case (per diode)
RthJC for various conduction angles d:
d
DC
180°
120°
60°
30°
RthJC (K/W)
1.00
1.02
1.04
1.07
1.10
Constants for Z calculation:
thJC
i
Rthi (K/W)
ti (s)
1
0.01
0.0012
2
0.03
0.095
3
0.96
0.455
Fig. 7 Transient thermal impedance
junction to heatsink (per diode)
RthJK for various conduction angles d:
d
DC
180°
120°
60°
30°
R (K/W)
thJK
1.20
1.22
1.24
1.27
1.30
Constants for ZthJK calculation:
i
Rthi (K/W)
ti (s)
1
0.01
0.0012
2
0.03
0.095
3
0.96
0.455
4
0.2
0.495
3-3
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