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MCP6232 Ver la hoja de datos (PDF) - Microchip Technology

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componentes Descripción
Fabricante
MCP6232
Microchip
Microchip Technology Microchip
MCP6232 Datasheet PDF : 40 Pages
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MCP6231/1R/1U/2/4
3.0 PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1 (single op amps) and Table 3-2 (dual and quad op amps).
TABLE 3-1: PIN FUNCTION TABLE FOR SINGLE OP AMPS
MCP6231
DFN, MSOP,
PDIP, SOIC
SOT-23-5
MCP6231R
SOT-23-5
MCP6231U
SOT-23-5
SC70
Symbol
Description
6
1
1
4
VOUT Analog Output
2
4
4
3
VIN– Inverting Input
3
3
3
1
VIN+ Non-inverting Input
7
5
2
5
VDD Positive Power Supply
4
2
5
2
VSS Negative Power Supply
1, 5, 8
—
—
—
NC No Internal Connection
9
—
—
—
EP Exposed Thermal Pad (EP); must be
connected to VSS.
TABLE 3-2: PIN FUNCTION TABLE FOR DUAL AND QUAD OP AMPS
MCP6232
MSOP, PDIP,
SOIC, TDFN
MCP6234
PDIP, SOIC, TSSOP
Symbol
Description
1
1
VOUTA
Analog Output (op amp A)
2
2
VINA–
Inverting Input (op amp A)
3
3
VINA+
Non-inverting Input (op amp A)
8
4
VDD
Positive Power Supply
5
5
VINB+
Non-inverting Input (op amp B)
6
6
VINB–
Inverting Input (op amp B)
7
7
VOUTB
Analog Output (op amp B)
—
8
VOUTC
Analog Output (op amp C)
—
9
VINC–
Inverting Input (op amp C)
—
10
VINC+
Non-inverting Input (op amp C)
4
11
VSS
Negative Power Supply
—
12
VIND+
Non-inverting Input (op amp D)
—
13
VIND–
Inverting Input (op amp D)
—
14
VOUTD
Analog Output (op amp D)
9
—
—
Exposed Thermal Pad (EP); must be connected to VSS.
3.1 Analog Outputs
The output pins are low-impedance voltage sources.
3.2 Analog Inputs
The non-inverting and inverting inputs are
high-impedance CMOS inputs with low bias currents.
3.3 Power Supply (VSS and VDD)
The positive power supply (VDD) is 1.8V to 6.0V higher
than the negative power supply (VSS). For normal
operation, the other pins are between VSS and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4 Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
© 2009 Microchip Technology Inc.
DS21881E-page 9

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