MC74HC1G00(2013) Ver la hoja de datos (PDF) - ON Semiconductor
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MC74HC1G00 Datasheet PDF : 6 Pages
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MC74HC1G00
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
VIN
VOUT
IIK
IOK
IOUT
ICC
TSTG
TL
TJ
qJA
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
SC70−5/SC−88A (Note 1)
TSOP−5
*0.5 to )7.0
*0.5 to VCC )0.5
*0.5 to VCC )0.5
$20
$20
$12.5
$25
*65 to )150
260
)150
350
230
V
V
V
mA
mA
mA
mA
_C
_C
_C
_C/W
PD
Power Dissipation in Still Air at 85_C
SC70−5/SC−88A
150
mW
TSOP−5
200
MSL
FR
VESD
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Level 1
Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
u2000
V
Machine Model (Note 3)
u200
Charged Device Model (Note 4)
N/A
ILATCHUP Latchup Performance
Above VCC and Below GND at 125_C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
VIN
VOUT
TA
tr , tf
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range
Input Rise and Fall Time
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
2.0
0.0
0.0
*55
0
0
0
0
6.0
V
VCC
V
VCC
V
)125
_C
1000
ns
600
500
400
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
http://onsemi.com
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