MC68181 Ver la hoja de datos (PDF) - Freescale Semiconductor

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MC68181

ROAMING FLEX™ chip SIGNAL PROCESSOR

Freescale Semiconductor 

MC68181

Thermal characteristics

Freescale Semiconductor, Inc.

Table 2-1 Maximum Ratings

Rating

Supply Voltage

All input voltages

Current drain per pin excluding VDD and VSS

Operating temperature range

Storage temperature

Symbol

VDD

VIN

I

TA

TSTG

Min

−0.5

−0.5

—

–30

–65

Max

6

6.5

10

+85

+150

Unit

V

V

mA

˚C

˚C

THERMAL CHARACTERISTICS

Table 2-2 Thermal Characteristics

Characteristic

Symbol TQFP Value Unit

Junction-to-ambient thermal resistance1

Thermal characterization parameter

RθJA or θJA

ΨJT

95

˚C/W

21

˚C/W

Note:

1. Junction-to-ambient thermal resistance is based on measurements on a horizontal, single-sided

Printed Circuit Board per SEMI G38-87 in natural convection.(SEMI is Semiconductor Equipment and

Materials International, 805 East Middlefield Rd., Mountain View, CA 94043, (415) 964-5111) Values

were measured with the parts mounted on thermal test boards meeting the specification EIA/

JESD51-3.

2-2

MC68181 Technical Data Sheet

MOTOROLA

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