MC33204DTBG(2014) Ver la hoja de datos (PDF) - ON Semiconductor
Número de pieza
componentes Descripción
Fabricante
MC33204DTBG Datasheet PDF : 17 Pages
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MC33201, MC33202, MC33204, NCV33202, NCV33204
2500
8 and 14 Pin DIP Pkg
2000
TSSOP-14 Pkg
1500
SO-14 Pkg
1000
SOIC-8
500
Pkg
0
- 55 - 40 - 25
0
25 50
85
125
TA, AMBIENT TEMPERATURE (°C)
Figure 2. Maximum Power Dissipation
versus Temperature
40
360 amplifiers tested from
35
3 (MC33204) wafer lots
30
VCC = + 5.0 V
VEE = Gnd
25
TA = 25°C
DIP Package
20
15
10
5.0
0
-10 - 8.0 - 6.0 - 4.0 - 2.0 0 2.0 4.0 6.0 8.0 10
VIO, INPUT OFFSET VOLTAGE (mV)
Figure 3. Input Offset Voltage Distribution
50
360 amplifiers tested from
3 (MC33204) wafer lots
40
VCC = + 5.0 V
VEE = Gnd
TA = 25°C
30
DIP Package
20
10
0
- 50 - 40 - 30 - 20 -10 0 10 20 30 40 50
TCVIO, INPUT OFFSET VOLTAGE TEMPERATURE COEFFICIENT (mV/°C)
Figure 4. Input Offset Voltage
Temperature Coefficient Distribution
200
VCC = + 5.0 V
VEE = Gnd
160
120
VCM = 0 V to 0.5 V
80
VCM > 1.0 V
40
0
- 55 - 40 - 25
0
25
70
85
125
TA, AMBIENT TEMPERATURE (°C)
Figure 5. Input Bias Current
versus Temperature
150
100
50
0
- 50
-100
-150
- 200
- 250
0
VCC = 12 V
VEE = Gnd
TA = 25°C
2.0
4.0
6.0
8.0
10
12
VCM, INPUT COMMON MODE VOLTAGE (V)
Figure 6. Input Bias Current
versus Common Mode Voltage
300
260
220
180
VCC = + 5.0 V
140
VEE = Gnd
RL = 600 W
DVO = 0.5 V to 4.5 V
100
- 55 - 40 - 25
0
25
70
85
TA, AMBIENT TEMPERATURE (°C)
105 125
Figure 7. Open Loop Voltage Gain versus
Temperature
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