MC100EP56 Ver la hoja de datos (PDF) - ON Semiconductor
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MC100EP56 Datasheet PDF : 11 Pages
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MC10EP56, MC100EP56
Table 3. ATTRIBUTES
Characteristics
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
SOIC
TSSOP
QFN
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Value
Value
75 kW
N/A
> 2 kV
> 150 V
> 2 kV
Pb Pkg
Pb−Free Pk
Level 1
Level 1
N/A
Level 3
Level 3
Level 1
UL 94 V−0 @ 0.125 in
140 Devices
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE
NECL Mode Power Supply
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
Iout
Output Current
VEE = 0 V
VCC = 0 V
VEE = 0 V
VCC = 0 V
Continuous
Surge
VI VCC
VI VEE
6
V
−6
V
6
V
−6
V
50
mA
100
mA
IBB
VBB Sink/Source
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
20 TSSOP
20 TSSOP
± 0.5
−40 to +85
−65 to +150
140
100
mA
°C
°C
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case) Standard Board
20 TSSOP
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
20 SOIC
20 SOIC
23 to 41
90
60
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case) Standard Board
20 SOIC
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
QFN−20
QFN−20
33 to 35
47
33
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case) Standard Board
QFN−20
Tsol
Wave Solder
Pb <2 to 3 sec @ 248°C
Pb−Free <2 to 3 sec @ 260°C
18
°C/W
265
°C
265
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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