MC100EPT21DR2 Ver la hoja de datos (PDF) - ON Semiconductor

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Fabricante

MC100EPT21DR2

3.3V Differential LVPECL/LVDS/CML to LVTTL/LVCMOS Translator

ON Semiconductor 

MC100EPT21

NC 1

D2

8 VCC

LVTTL

7Q

D3

LVPECL

VBB 4

6 NC

5 GND

Figure 1. Logic Diagram and 8−Lead Pinout (Top View)

Table 1. PIN DESCRIPTION

PIN

Q

D**, D**

VCC

VBB

GND

NC

FUNCTION

LVTTL/LVCMOS Output

Differential LVPECL/LVDS/CML Input

Positive Supply

Output Reference Voltage

Ground

No Connect

EP

Exposed pad must be connected to a

sufficient thermal conduit. Electrically

connect to the most negative supply or

leave floating open.

** Pins will default to VCC/2 when left open.

Table 2. ATTRIBUTES

Characteristics

Internal Input Pulldown Resistor

Internal Input Pullup Resistor

ESD Protection

Human Body Model

Machine Model

Charged Device Model

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

Flammability Rating

Oxygen Index: 28 to 34

Transistor Count

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Value

50 kW

50 kW

> 1.5 kV

> 100 V

> 2 kV

Level 1

UL 94 V−0 @ 0.125 in

81 Devices

Table 3. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

VCC

PECL Power Supply

GND = 0 V

VIN

PECL Input Voltage

GND = 0 V

IBB

VBB Sink/Source

TA

Operating Temperature Range

Tstg

Storage Temperature Range

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

VI  VCC

SO−8

SO−8

3.8

0 to 3.8

± 0.5

−40 to +85

−65 to +150

190

130

V

V

mA

°C

°C

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case) Standard Board

SO−8

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

TSSOP−8

TSSOP−8

41 to 44

185

140

°C/W

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case) Standard Board

TSSOP−8

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

DFN8

DFN8

41 to 44

129

84

°C/W

°C/W

°C/W

Tsol

Wave Solder

Pb < 2 to 3 sec @ 248°C

Pb−Free <2 to 3 sec @ 260°C

265

°C

265

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

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