MAX3867 Ver la hoja de datos (PDF) - Maxim Integrated
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MAX3867 Datasheet PDF : 12 Pages
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+3.3V, 2.5Gbps SDH/SONET Laser Driver
with Automatic Power Control
Modulation Current More than 60mA
At +5V power supply, the headroom voltage for the
MAX3867 is significantly improved. In this case, it is
possible to achieve a modulation current of more than
60mA with AC-coupling, if the junction temperature is
kept below 150°C. The MAX3867 can also be DC-cou-
pled to a laser diode when operating at +5V supply; the
voltage at OUT+ should be ≥ 2.0V for proper operation.
Wire Bonding Die
For high current density and reliable operation, the
MAX3867 uses gold metalization. Make connections to
the die with gold wire only, using ball-bonding tech-
niques. Wedge bonding is not recommended. Die-pad
size is 4 mils (100µm) square, and die thickness is 12
mils (300µm) mils.
Layout Considerations
To minimize inductance, keep the connections between
the MAX3867 output pins and LD as close as possible.
Optimize the laser diode performance by placing a
bypass capacitor as close as possible to the laser
anode. Use good high-frequency layout techniques
and multilayer boards with uninterrupted ground planes
to minimize EMI and crosstalk.
Laser Safety and IEC 825
Using the MAX3867 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections must
be considered. Each customer must determine the level
of fault tolerance required by their application, recogniz-
ing that Maxim products are not designed or authorized
for use as components in systems intended for surgical
implant into the body, for applications intended to sup-
port or sustain life, or for any other application where the
failure of a Maxim product could create a situation
where personal injury or death may occur.
TOP VIEW
Pin Configuration
48 47 46 45 44 43 42 41 40 39 38 37
GND2 1
GND1 2
VCC1 3
DATA+ 4
DATA- 5
VCC1 6
GND1 7
VCC1 8
CLK+ 9
CLK- 10
VCC1 11
GND1 12
MAX3867
36 GND3
35 MD
34 GND3
33 GND4
32 VCC4
31 N.C.
30 OUT-
29 OUT+
28 N.C.
27 VCC4
26 N.C.
25 BIAS
13 14 15 16 17 18 19 20 21 22 23 24
TQFP
GND1
LATCH
ENABLE
GND1
GND1
SLWSTRT
VCC1
FAIL
GND4
N.C.
APCFILT
GND4
VCC4
BIAS
Chip Topography
CLK- VCC1 VCC1 DATA+ GND1
VCC1 CLK+ GND1 DATA- VCC1
GND2
VCC2
BIASMAX
MODSET
GND2
APCSET
N.C. 0.083"
GND2 (2.108mm)
N.C.
GND3
N.C.
CAPC
VCC3
GND3
N.C. N.C. OUT- VCCA GND3
VCC4 OUT+ N.C. GND4 MD
0.070"
(1.778mm)
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