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MAS9278 Ver la hoja de datos (PDF) - Micro Analog systems

Número de pieza
componentes Descripción
Fabricante
MAS9278
MAS
Micro Analog systems MAS
MAS9278 Datasheet PDF : 5 Pages
1 2 3 4 5
DA9278.004
11 November, 2010
PIN DESCRIPTION
Pin Description
Symbol
x-coordinate
y-coordinate
Power Supply Voltage
Serial Bus Data Input
Serial Bus Clock Input
VDD
177
DA
435
CLK
201
172
1015
1015
Programming Input
PV
1042
1015
Voltage Control Input
VC
1012
158
Crystal Oscillator Output
X1
374
158
Power Supply Ground
VSS
830
1008
Crystal/Varactor Oscillator Input
X2
817
158
Buffer Output
OUT
665
1015
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Input Voltage
Power Dissipation
Storage Temperature
Note: Not valid for programming pin PV.
Symbol
VDD - VSS
VIN
PMAX
TST
Min
-0.3
VSS -0.3
-55
Max
6.0
VDD + 0.3
20
150
Unit
V
V
mW
oC
Note
1)
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Supply Current
Operating Temperature
Crystal Load Capacitance
Symbol
VDD
ICC
TC
CL
Conditions
Vcc = 2.8 Volt
Min Typ Max Unit
2.7 2.8 5.5
V
0.85
mA
-30
+85
oC
7.0
pF
2 (5)

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