MAPCGM0001-DIE Ver la hoja de datos (PDF) - Tyco Electronics
Número de pieza
componentes Descripción
Fabricante
MAPCGM0001-DIE Datasheet PDF : 5 Pages
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Phase Shifter
1.0-1.9 GHz
Assembly and Bonding Diagram
100 pF
0.1 μF
VEE
6
P0 P1 P2 VEE P3 P4 P5
RFIN
IN
MAPCGM0001-DIE
903215 —
Preliminary Information
CONTROL
INPUTS
RFOUT
OUT
Figure 8. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization.
Truth Table3
Designation
P5
P4
P3
VEE
P2
P1
P0
Description
180° Phase Bit : MSB
90° Phase Bit
45° Phase Bit
Digital Supply Voltage
22.5° Phase Bit
11.2° Phase Bit
5.6° Phase Bit : LSB
3. All Phase Bits at Logic Low = Reference State.
Level
Logic High
Logic High
Logic High
-5V
Logic High
Logic High
Logic High
State
Phase Shift ≈ -180°
Phase Shift ≈ -90°
Phase Shift ≈ -45°
ON
Phase Shift ≈ -22.5°
Phase Shift ≈ -11.2°
Phase Shift ≈ -5.6°
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VEE before applying positive bias to Control Pads.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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