MAAP-000076-MCH000 Ver la hoja de datos (PDF) - Tyco Electronics
Número de pieza
componentes Descripción
Fabricante
MAAP-000076-MCH000 Datasheet PDF : 8 Pages
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Amplifier, Power, 16W
1.3-2.5 GHz
Mechanical Information
Chip Size: 5.203 x 8.352 x 0.356 mm (205 x 329 x 14 mils)
MAAP-000076-PED000
Rev —
Preliminary Datasheet
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Bond Pad Dimensions
Figure 17. Die Layout
Pad
RF In and Out
DC Drain Supply Voltage VD1
Pad No.
1
2
DC Drain Supply Voltage VD2
3
DC Gate Supply Voltage VG1
4
DC Gate Supply Voltage VG2
5
6
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Size (μm)
200 x 250
200 x 150
Size (mils)
8 x 10
4x8
500 x 200
150 x 125
20 x 8
6x5
100 x 100
4x4
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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