DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

HLMT-DH00 Ver la hoja de datos (PDF) - HP => Agilent Technologies

Número de pieza
componentes Descripción
Fabricante
HLMT-DH00 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Absolute Maximum Ratings at TA = 25°C
(T-13/4 Package)
DC Forward Current[1,4,5] ........................................................... 50 mA
Peak Forward Current[2] ........................................................... 200 mA
Time Average Input Power[2] ................................................... 103 mW
Transient Forward Current[3] (10 µs Pulse) .............................. 500 mA
Reverse Voltage (IR = 100 µA) ......................................................... 5 V
Operating Temperature Range .......................................... -40 to 100°C
Storage Temperature ......................................................... -40 to 120°C
Junction Temperature ................................................................. 130°C
Soldering Temperature .......................................... 260°C for 5 seconds
[1.59 mm (0.06 in.) below seating plane]
Notes:
1. Derate linearly as shown in Figure 4.
2. Any pulsed operation cannot exceed the Absolute Max Peak Forward Current or the
Max Allowable Time Average Power as specified in Figure 5.
3. The transient peak current is the maximum nonrecurring peak current the device can
withstand without damaging the LED die and wire bonds.
4. Drive Currents between 10 and 30 mA are recommended for best long term
performance.
5. Operation at currents below 10 mA is not recommended, please contact your
Hewlett-Packard sales representative.
Absolute Maximum Ratings at TA = 25°C (T-1 Package)
DC Forward Current[1,4,5] ........................................................... 50 mA
Peak Forward Current[2] ........................................................... 200 mA
Time Average Input Power[2] ................................................... 103 mW
Transient Forward Current[3] (10 µs Pulse) .............................. 500 mA
Reverse Voltage (IR = 100 µA) ......................................................... 5 V
Operating Temperature Range .......................................... -40 to 100°C
Storage Temperature ......................................................... -40 to 100°C
Junction Temperature .................................................................. 110°C
Solder Temperature ................................................ 260°C for 5 seconds
[1.59 mm (0.06 in.) below seating plane]
Notes:
1. Derate linearly as shown in Figure 4.
2. Any pulsed operation cannot exceed the Absolute Max Peak Forward Current or the
Max Allowable Time Average Power as specified in Figure 5.
3. The transient peak current is the maximum nonrecurring peak current the device can
withstand without damaging the LED die and wire bonds.
4. Drive Currents between 10 mA and 30 mA are recommended for best long term
performance.
5. Operation at currents below 10 mA is not recommended, please contact your
Hewlett-Packard sales representative.
1-39

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]