M27C320 Ver la hoja de datos (PDF) - STMicroelectronics
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M27C320 Datasheet PDF : 15 Pages
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M27C320
Table 7. Read Mode DC Characteristics (1)
(TA = 0 to 70 °C, –40 to 85 °C or –40 to 125 °C; VCC = 5V ± 10%)
Symbol
Parameter
Test Condition
Min
ILI
Input Leakage Current
ILO Output Leakage Current
ICC Supply Current
0V ≤ VIN ≤ VCC
0V ≤ VOUT ≤ VCC
E = VIL, G = VIL, IOUT = 0mA,
f = 8MHz
E = VIL, G = VIL, IOUT = 0mA,
f = 5MHz
ICC1
ICC2
IPP
VIL
Supply Current (Standby) TTL
Supply Current (Standby) CMOS
Program Current
Input Low Voltage
E = VIH
E > VCC – 0.2V
VPP = VCC
–0.3
VIH (2) Input High Voltage
2
VOL Output Low Voltage
IOL = 2.1mA
VOH Output High Voltage TTL
IOH = –400µA
2.4
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Maximum DC voltage on Output is VCC +0.5V.
Max Unit
±1
µA
±10
µA
70
mA
50
mA
1
mA
100
µA
10
µA
0.8
V
VCC + 1
V
0.4
V
V
Two Line Output Control
Because EPROMs are usually used in larger
memory arrays, this product features a 2 line con-
trol function which accommodates the use of mul-
tiple memory connection. The two line control
function allows:
a. the lowest possible memory power dissipation,
b. complete assurance that output bus contention
will not occur.
For the most efficient use of these two control
lines, E should be decoded and used as the prima-
ry device selecting function, while G should be
made a common connection to all devices in the
array and connected to the READ line from the
system control bus. This ensures that all deselect-
ed memory devices are in their low power standby
mode and that the output pins are only active
when data is required from a particular memory
device.
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require careful decoupling of the
supplies to the devices. The supply current ICC
has three segments of importance to the system
designer: the standby current, the active current
and the transient peaks that are produced by the
falling and rising edges of E.
The magnitude of the transient current peaks is
dependent on the capacitive and inductive loading
of the device outputs. The associated transient
voltage peaks can be suppressed by complying
with the two line output control and by properly se-
lected decoupling capacitors. It is recommended
that a 0.1µF ceramic capacitor is used on every
device between VCC and VSS. This should be a
high frequency type of low inherent inductance
and should be placed as close as possible to the
device. In addition, a 4.7µF electrolytic capacitor
should be used between VCC and VSS for every
eight devices. This capacitor should be mounted
near the power supply connection point. The pur-
pose of this capacitor is to overcome the voltage
drop caused by the inductive effects of PCB trac-
es.
5/15
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