LX5115CDW Ver la hoja de datos (PDF) - Microsemi Corporation
Número de pieza
componentes Descripción
Fabricante
LX5115CDW Datasheet PDF : 4 Pages
| |||
LX5115
PRODUCT DATABOOK 1996/1997
ULTRA 9-CHANNEL SCSI TERMINATOR
PRODUCTION DATA SHEET
UltraMAX
A B S O L U T E M A X I M U M R A T I N G S (Note 1)
Continuous Termination Voltage .......................................................................... 10V
Continuous Output Voltage Range .............................................................. 0 to 5.5V
Continuous Disable Voltage Range .............................................................. 0 to 5.5V
Operating Junction Temperature ........................................................... 0°C to 125°C
Storage Temperature Range ............................................................. -65°C to +150°C
Solder Temperature (Soldering, 10 seconds) ................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device.
T H E R MAL DATA
D PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
DW PACKAGE:
120°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
PWP PACKAGE:
95°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
139°C/W
Junction Temperature Calculation: T = T + (P x θ ).
J
A
D
JA
The θ numbers are guidelines for the thermal performance of the device/pc-board system.
JA
All of the above assume no ambient airflow.
PACKAGE PIN OUTS
TERM POWER
D0
D1
D2
D3
D4
N.C.
GND
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
DISABLE
N.C.
D8
D7
D6
D5
N.C.
N.C.
D PACKAGE
(Top View)
TERM POWER
1
D0
2
D1
3
D2
4
D3
5
D4
6
N.C.
7
GND
8
16
DISABLE
15
N.C.
14
N.C.
13
D8
12
D7
11
D6
10
D5
9
N.C.
DW PACKAGE
(Top View)
TERM POWER
HEATSINK/GND
2
D0
3
D1
4
D2
5
D3
6
D4
7
HEATSINK/GND
8
N.C.
9
GND
10
20
DISABLE
19
N.C.
18
HEATSINK/GND
17
N.C.
16
D8
15
D7
14
D6
13
D5
12
HEATSINK/GND
11
N.C.
PWP PACKAGE
(Top View)
2
Copyright © 1997
Rev. 1.1 12/97
Share Link: 