LTC4218CGN(RevB) Ver la hoja de datos (PDF) - Linear Technology
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LTC4218CGN Datasheet PDF : 16 Pages
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LTC4218
PACKAGE DESCRIPTION
DHC Package
16-Lead Plastic DFN (5mm × 3mm)
(Reference LTC DWG # 05-08-1706)
0.65 ±0.05
3.50 ±0.05
1.65 ±0.05
(2 SIDES)
2.20 ±0.05
PACKAGE
OUTLINE
PIN 1
TOP MARK
(SEE NOTE 6)
0.25 ± 0.05
0.50 BSC
4.40 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.200 REF
5.00 ±0.10
(2 SIDES)
R = 0.20
TYP
3.00 ±0.10
(2 SIDES)
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
R = 0.115
TYP
0.40 ± 0.10
9
16
8
1
0.25 ± 0.05
0.50 BSC
4.40 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
PIN 1
NOTCH
(DHC16) DFN 1103
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.254 MIN
.045 ±.005
.150 – .165
.189 – .196*
(4.801 – 4.978)
16 15 14 13 12 11 10 9
.009
(0.229)
REF
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
.0165 ± .0015
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
.007 – .0098
(0.178 – 0.249)
.015 ± .004
(0.38 ± 0.10)
× 45°
0° – 8° TYP
1 234 5678
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2.
DIMENSIONS
ARE
IN
INCHES
(MILLIMETERS)
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
.008 – .012
(0.203 – 0.305)
TYP
.0250
(0.635)
BSC
GN16 (SSOP) 0204
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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