PACKAGE DESCRIPTIO
0.62
0.95
MAX
REF
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
1.22 REF
LTC1844 Series
2.90 BSC
(NOTE 4)
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.30 – 0.50 REF
0.09 – 0.20
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
PIN ONE
0.95 BSC
0.80 – 0.90
1.00 MAX
1.90 BSC
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.01 – 0.10
S5 TSOT-23 0302
1844ia
11