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LT5520EUF Ver la hoja de datos (PDF) - Linear Technology

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LT5520EUF Datasheet PDF : 12 Pages
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LT5520
PI FU CTIO S
GND (Pins 1, 4, 9, 12, 13, 16): Internal Grounds. These
pins are used to improve isolation and are not intended as
DC or RF grounds for the IC. Connect these pins to low
impedance grounds for best performance.
IF+, IF(Pins 2, 3): Differential IF Signal Inputs. A differ-
ential signal must be applied to these pins through DC
blocking capacitors. The pins must be connected to ground
with 100resistors (the grounds must each be capable of
sinking about 18mA). For best LO leakage performance,
these pins should be DC isolated from each other. An
impedance transformation is required to match the IF
input to the desired source impedance (typically 50or
75).
EN (Pin 5): Enable Pin. When the applied voltage is greater
than 3V, the IC is enabled. When the applied voltage is less
than 0.5V, the IC is disabled and the DC current drops to
about 1µA.
VCC1 (Pin 6): Power Supply Pin for the Bias Circuits.
Typical current consumption is about 2mA. This pin
should be externally connected to VCC and have appropri-
ate RF bypass capacitors.
VCC2 (Pin 7): Power Supply Pin for the LO Buffer Circuits.
Typical current consumption is about 22mA. This pin
should have appropriate RF bypass capacitors as shown
in Figure 2. The 1000pF capacitor should be located as
close to the pins as possible.
VCC3 (Pin 8): Power Supply Pin for the Internal Mixer.
Typical current consumption is about 36mA. This pin
should be externally connected to VCC through an induc-
tor. A 39nH inductor is used in Figure 2, though the value
is not critical.
RF, RF+ (Pins 10, 11): Differential RF Outputs. One pin
may be DC connected to a low impedance ground to realize
a 50single-ended output. No external matching compo-
nents are required. A DC voltage should not be applied
across these pins, as they are internally connected through
a transformer winding.
LO+, LO(Pins 14, 15): Differential Local Oscillator In-
puts. The LT5520 works well with a single-ended source
driving the LO+ pin and the LOpin connected to a low
impedance ground. No external matching components are
required. An internal resistor is connected across these
pins; therefore, a DC voltage should not be applied across
the inputs.
GROUND (Pin 17, Exposed Pad): DC and RF ground
return for the entire IC. This must be soldered to the
printed circuit board low impedance ground plane.
BLOCK DIAGRA
GND 13
LO+ 14
LO15
GND 16
BACKSIDE
GROUND GND RF+ RF GND
17
12
11
10
9
5pF
HIGH SPEED
LO BUFFER
85
5pF
7
1
2
VCC2 GND
IF+
10pF
DOUBLE-
BALANCED
MIXER
BIAS
8 VCC3
6 VCC1
5 EN
3
4
5520 BD
IF GND
5520f
5

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