LT3463A Ver la hoja de datos (PDF) - Linear Technology

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LT3463A

Dual Micropower DC/DC Converters with Schottky Diodes

Linear Technology 

TYPICAL APPLICATIO

VIN

2.7V

TO 5V C1

1µF

LT3463/LT3463A

Dual Output ±20V Converter

L1

10µH

3

21

VIN

9

SHDN1

SW1 VOUT1

10

FB1

LT3463 VREF 7

8

SHDN2

6

FB2

GND SW2 D2

11

4

5

L2

10µH

C4

0.1µF

D1

R2

1M

R1

66.5k

R3

61.9k

R4

1M

C3

0.47µF

VOUT1

20V

9mA

C2

0.47µF

VOUT2

–20V

9mA

3463 TA02

PACKAGE DESCRIPTIO

DD Package

10-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1699)

0.675 ±0.05

R = 0.115

TYP

6

0.38 ± 0.10

10

3.50 ±0.05

1.65 ±0.05

2.15 ±0.05 (2 SIDES)

PIN 1

PACKAGE TOP MARK

OUTLINE (SEE NOTE 6)

0.25 ± 0.05

0.50

BSC

2.38 ±0.05

(2 SIDES)

0.200 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).

CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

3.00 ±0.10 1.65 ± 0.10

(4 SIDES) (2 SIDES)

0.75 ±0.05

0.00 – 0.05

(DD10) DFN 1103

5

1

0.25 ± 0.05

0.50 BSC

2.38 ±0.10

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

3463f

7

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