LT3462 Ver la hoja de datos (PDF) - Linear Technology
Número de pieza
componentes Descripción
Fabricante
LT3462 Datasheet PDF : 8 Pages
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LT3462/LT3462A
TYPICAL APPLICATIO S
VIN
2.7V
TO 4.2V
3.3V to –8V (LT3462A)
L1A
10µH
C2
1µF
L1B
10µH
VOUT
C1
SW D
VIN
FB
R1
267k
–8V
C4
35mA
22pF
1µF
LT3462A
R2
C3
42.2k
4.7µF
SDREF
GND
5V to –5V Supply (LT3462A)
VIN
L1
22µH
C2
1µF
L2
22µH
5V
C1
SW D
VIN
FB
R1
267k
C4
22pF
1µF
LT3462A
R2
68.1k
SDREF
GND
C1: TAIYO YUDEN JMK107BJ105MA
C2: TAIYO YUDEN EMK212BJ105MA
C3: TAIYO YUDEN LMK316BJ475
..
L1: WURTH 50310057-100
3462 TA04a
C1: TAIYO YUDEN JMK107BJ105MA
C2: TAIYO YUDEN EMK212BJ105MA
C3: MURATA GRM219R60J106KE19B
L1, L2: MURATA LQH32CN220
Switching Waveform
VOUT
–5V
100mA
C3
10µF
3462 TA05a
INDUCTOR
50mA/DIV
VSW
10V/DIV
VOUT
1mV/DIV
AC COUPLED
200ns/DIV
3462 TA05b
PACKAGE DESCRIPTIO
0.62
0.95
MAX
REF
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
2.90 BSC
(NOTE 4)
1.22 REF
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC 1.50 – 1.75
(NOTE 4)
PIN ONE ID
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD
FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.95 BSC
0.80 – 0.90
0.09 – 0.20
(NOTE 3)
1.00 MAX
0.30 – 0.50 REF
1.90 BSC
0.30 – 0.45
6 PLCS (NOTE 3)
0.01 – 0.10
S6 TSOT-23 0302
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3462af
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