LT1946EMS8 Ver la hoja de datos (PDF) - Linear Technology

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LT1946EMS8

1.2MHz Boost DC/DC Converter with 1.5A Switch and Soft-Start

Linear Technology 

PACKAGE DESCRIPTIO

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660)

LT1946

0.889 ± 0.127

(.035 ± .005)

3.00 ± 0.102

(.118 ± .004)

(NOTE 3)

8 7 65

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.254

DETAIL “A”

4.90 ± 0.152

(.193 ± .006)

(.010)

0° – 6° TYP

0.42 ± 0.038

(.0165 ± .0015)

TYP

0.65

(.0256)

BSC

RECOMMENDED SOLDER PAD LAYOUT

GAUGE PLANE

0.53 ± 0.152

(.021 ± .006)

DETAIL “A”

1 234

1.10

(.043)

MAX

0.18

(.007)

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

SEATING

PLANE

0.22 – 0.38

(.009 – .015)

TYP

0.65

(.0256)

BSC

0.52

(.0205)

REF

3.00 ± 0.102

(.118 ± .004)

(NOTE 4)

0.86

(.034)

REF

0.127 ± 0.076

(.005 ± .003)

MSOP (MS8) 0204

MS8E Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1662)

2.794 ± 0.102

(.110 ± .004)

0.889 ± 0.127

(.035 ± .005)

3.00 ± 0.102

(.118 ± .004)

(NOTE 3)

8 7 65

5.23

(.206)

MIN

2.083 ± 0.102 3.20 – 3.45

(.082 ± .004) (.126 – .136)

0.254

(.010)

DETAIL “A”

0° – 6° TYP

4.90 ± 0.152

(.193 ± .006)

0.42 ± 0.038

(.0165 ± .0015)

TYP

0.65

(.0256)

BSC

RECOMMENDED SOLDER PAD LAYOUT

GAUGE PLANE

0.18

(.007)

0.53 ± 0.152

(.021 ± .006)

DETAIL “A”

1 234

1.10

(.043)

MAX

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

SEATING

PLANE

0.22 – 0.38

(.009 – .015)

TYP

0.65

(.0256)

BSC

0.52

(.0205)

REF

BOTTOM VIEW OF

EXPOSED PAD OPTION

2.06 ± 0.102

1

(.081 ± .004)

1.83 ± 0.102

(.072 ± .004)

3.00 ± 0.102

(.118 ± .004)

(NOTE 4)

8

0.86

(.034)

REF

0.127 ± 0.076

(.005 ± .003)

MSOP (MS8E) 0603

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

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