LT1571-1 Ver la hoja de datos (PDF) - Linear Technology
Número de pieza
componentes Descripción
Fabricante
LT1571-1
Linear Technology
LT1571-1 Datasheet PDF : 16 Pages
| |||
LT1571 Series
ABSOLUTE AXI U RATI GS (Note 1)
Supply Voltage (VCC) .............................................. 28V
BOOST Pin Voltage with Respect to VCC ................. 20V
FLAG Pin Voltage ..................................................... VCC
IBAT (Average)........................................................ 1.5A
Switch Current (Peak) .............................................. 2A
Operating Ambient
Temperature Range (Note 2) .................. – 40°C to 85°C
Operating Junction
Temperature Range .............................. – 40°C to 125°C
Lead Temperature (Soldering, 10 sec).................. 300°C
Storage Temperature Range ................. – 65°C to 150°C
UW U
PACKAGE/ORDER I FOR ATIO
**GND 1
SW 2
BOOST 3
BAT2 4
FLAG 5
SELECT 6
SENSE 7
**GND 8
TOP VIEW
16 GND**
15 VCC1*
14 VCC2*
13 CAP
12 PROG
11 VC
10 BAT
9 GND**
GN PACKAGE
16-LEAD NARROW PLASTIC SSOP
TJMAX = 125°C, θJA = 75°C/ W
* VCC1 AND VCC2 SHOULD BE CONNECTED
TOGETHER CLOSE TO THE PINS
** FOUR CORNER PINS ARE FUSED TO
INTERNAL DIE ATTACH PADDLE FOR
HEAT SINKING. CONNECT THESE FOUR
PINS TO EXPANDED PC LANDS FOR
PROPER HEAT SINKING
TOP VIEW
**GND 1
**GND 2
**GND 3
SW 4
BOOST 5
NC 6
FLAG 7
NC 8
VFB 9
SENSE 10
**GND 11
**GND 12
**GND 13
**GND 14
28 GND**
27 GND**
26 GND**
25 GND**
24 VCC1*
23 VCC2*
22 CAP
21 PROG
20 VC
19 BAT
18 GND**
17 GND**
16 GND**
15 GND**
GN PACKAGE
28-LEAD NARROW PLASTIC SSOP
TJMAX = 125°C, θJA = 40°C/ W
* VCC1 AND VCC2 SHOULD BE CONNECTED TOGETHER
CLOSE TO THE PINS
** ALL GND PINS ARE FUSED TO INTERNAL DIE ATTACH
PADDLE FOR HEAT SINKING. CONNECT THESE PINS TO
EXPANDED PC LANDS FOR PROPER HEAT SINKING
40°C/W THERMAL RESISTANCE ASSUMES AN INTERNAL
GROUND PLANE DOUBLING AS A HEAT SPREADER
TOP VIEW
**GND 1
**GND 2
**GND 3
SW 4
BOOST 5
BAT2 6
FLAG 7
NC 8
SELECT 9
SENSE 10
**GND 11
**GND 12
**GND 13
**GND 14
28 GND**
27 GND**
26 GND**
25 GND**
24 VCC1*
23 VCC2*
22 CAP
21 PROG
20 VC
19 BAT
18 GND**
17 GND**
16 GND**
15 GND**
GN PACKAGE
28-LEAD NARROW PLASTIC SSOP
TJMAX = 125°C, θJA = 40°C/ W
* VCC1 AND VCC2 SHOULD BE CONNECTED TOGETHER
CLOSE TO THE PINS
** ALL GND PINS ARE FUSED TO INTERNAL DIE ATTACH
PADDLE FOR HEAT SINKING. CONNECT THESE PINS TO
EXPANDED PC LANDS FOR PROPER HEAT SINKING
40°C/W THERMAL RESISTANCE ASSUMES AN INTERNAL
GROUND PLANE DOUBLING AS A HEAT SPREADER
ORDER PART NUMBER
LT1571EGN-5
Consult factory for Industrial and Military grade parts.
ORDER PART NUMBER
LT1571EGN-1
ORDER PART NUMBER
LT1571EGN-2
2
Share Link: