LT1026CH Ver la hoja de datos (PDF) - Linear Technology
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LT1026CH Datasheet PDF : 8 Pages
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LT1026
PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted.
J8 Package
8-Lead CERDIP (Narrow 0.300, Hermetic)
(LTC DWG # 05-08-1110)
CORNER LEADS OPTION
(4 PLCS)
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.300 BSC
(0.762 BSC)
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
0.005
(0.127)
MIN
0.025
(0.635)
RAD TYP
0.405
(10.287)
MAX
8
7
6
5
0.220 – 0.310
(5.588 – 7.874)
1
2
3
4
0.200
(5.080)
MAX
0.015 – 0.060
(0.381 – 1.524)
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
0.045 – 0.068
(1.143 – 1.727)
0.014 – 0.026
(0.360 – 0.660)
N8 Package
8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
0.400*
(10.160)
MAX
8
7
6
5
0.125
3.175
0.100 ± 0.010 MIN
(2.540 ± 0.254)
J8 1197
0.255 ± 0.015*
(6.477 ± 0.381)
0.300 – 0.325
(7.620 – 8.255)
12
0.045 – 0.065
(1.143 – 1.651)
34
0.130 ± 0.005
(3.302 ± 0.127)
0.009 – 0.015
(0.229 – 0.381)
0.065
(1.651)
TYP
+0.035
0.325 –0.015
( ) 8.255
+0.889
–0.381
0.100 ± 0.010
(2.540 ± 0.254)
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
0.125
(3.175)
MIN
0.018 ± 0.003
(0.457 ± 0.076)
0.020
(0.508)
MIN
N8 1197
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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