LMV331, LMV393, LMV339
MAXIMUM RATINGS
Symbol
VS
VIDR
TJ
Tstg
TL
VESD
Rating
Voltage on any Pin (referred to V− pin)
Input Differential Voltage Range
Maximum Junction Temperature
Storage Temperature Range
Mounting Temperature (Infrared or Convection (1/16″ From Case for 30 Seconds))
ESD Tolerance (Note 1)
Machine Model
Human Body Model
Value
Unit
5.5
V
±Supply Voltage
V
150
°C
−65 to 150
°C
260
°C
V
100
1000
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Value
Unit
VCC
Supply Voltage Temperature Range (Note 2)
qJA
Thermal Resistance
SC−70
TSOP−5
ULLGA8
Micro8
SOIC−8
UDFN8
SOIC−14
TSSOP−14
2.7 to 5.0
280
333
340
238
212
350
156
190
V
°C/W
1. Human Body Model, applicable std. MIL−STD−883, Method 3015.7. Machine Model, applicable std. JESD22−A115−A (ESD MM std. of
JEDEC) Field−Induced Charge−Device Model, applicable std. JESD22−C101−C (ESD FICDM std. of JEDEC).
2. The maximum power dissipation is a function of TJ(MAX), qJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) − TA)/qJA. All numbers apply for packages soldered directly onto a PC board.
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