LMV331, LMV393, LMV339
MARKING DIAGRAMS
SC−70
CASE 419A
TSOP−5
CASE 483
UDFN8
CASE 517AJ
5
CCAMG
G
CCA = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
Micro8
CASE 846A
8
V393
AYWG
G
1
3CAAYWG
G
CAMG
G
1
A = Assembly Location
Y = Year
W = Work Week
G = Pb−Free Package
CA = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
(Note: Microdot may be in either location)
SOIC−8
CASE 751
8
V393
ALYW G
G
1
ULLGA8
CASE 613AG
1
XXMG
A
= Assembly Location
A
Y
= Year
L
W
= Work Week
Y
G
= Pb−Free Package
W
(Note: Microdot may be in either location)
G
SOIC−14
CASE 751A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
XX = Specific Device Code
M = Date Code
G = Pb−Free Package
TSSOP−14
CASE 948G
14
LMV339
AWLYWWG
1
14
LMV
339
ALYWG
G
1
A
= Assembly Location
WL = Wafer Lot
Y
= Year
WW = Work Week
G
= Pb−Free Package
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
SC−70/TSOP−5
PACKAGE PINOUTS
Micro8 / SOIC−8 / UDFN8
SOIC−14 / TSSOP−14
+IN
GND
−IN
1
5 VCC
Output A 1
8 VCC
2
+
−
3
2
−
4 OUTPUT Inputs A
+
3
7
Output B
−6
(Top Views)
GND 4
ULLGA8
+
5
Inputs B
NC
(Top Views)
IN− 1
8
7 OUT
IN+ 2
6 NC
VCC−/GND
3
4
5
NC
(Top Views)
VCC+
NC − No Internal Connection
Output 2 1
Output 1 2
VCC 3
− Input 1 4 *
+ Input 1 5 ) 1
− Input 2 6 *)2
+ Input 2 7
14 Output 3
13 Output 4
12 GND
) 11 + Input 4
4 * 10 − Input 4
)9
3*
8
+ Input 3
− Input 3
(Top Views)
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