LH532100BD Ver la hoja de datos (PDF) - Sharp Electronics
Número de pieza
componentes Descripción
Fabricante
LH532100BD Datasheet PDF : 8 Pages
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CMOS 2M MROM
LH532100B
A17 30
A16 2
A15 3
A14 29
A13 28
A12 4
A11 25
A10 23
A9 26
A8 27
A7 5
A6 6
A5 7
A4 8
A3 9
A2 10
A1 11
A0 12
MEMORY
MATRIX
(262,144 x 8)
COLUMN SELECTOR
SENSE AMPLIFIER
CE/CE 22
CE
BUFFER
TIMING
GENERATOR
OE/OE 24
OE1/OE1/DC 1
OE
BUFFER
OUTPUT BUFFER
32 16
13 14 15 17 18 19 20 21
VCC GND
D0 D1 D2 D3 D4 D5 D6 D7
NOTE: Pin numbers apply to the 32-pin DIP, SOP, QFJ, or TSOP (Type II).
Figure 5. LH532100B Block Diagram
PIN DESCRIPTION
SIGNAL
PIN NAME
NOTE
SIGNAL
PIN NAME
A0 – A17
D0 – D7
CE
OE/OE
Address input
Data output
Chip Enable input
Output Enable input
OE1/OE1/DC
Output Enable input/
Don’t Care connection
VCC
Power supply (+5 V)
1
GND
Ground
NOTE:
1. Active levels of OE/OE and OE1/OE1/DC are mask-programmable.
Selecting DC allows the outputs to be active for both high and low levels applied to this pin.
It is recommended to apply either a HIGH or a LOW to the DC pin.
TRUTH TABLE
CE
OE/OE
H
X
L
L/H
L
X
L
H/L
NOTE:
X = H or L
OE1/OE1
X
X
L/H
H/L
MODE
Non selected
Non selected
Non selected
Selected
D0 – D7
High-Z
High-Z
High-Z
DOUT
SUPPLY CURRENT
Standby (ISB)
Operating (ICC)
Operating (ICC)
Operating (ICC)
532100B-4
NOTE
1
3
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