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L74VHC1G66DFT2 Ver la hoja de datos (PDF) - Leshan Radio Company,Ltd

Número de pieza
componentes Descripción
Fabricante
L74VHC1G66DFT2
LRC
Leshan Radio Company,Ltd LRC
L74VHC1G66DFT2 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
LESHAN RADIO COMPANY, LTD.
L74VHC1G66
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
VCC
VIN
VIS
IIK
ICC
TSTG
TL
TJ
qJA
DC Supply Voltage
Digital Input Voltage
Analog Output Voltage
Digital Input Diode Current
DC Supply Current, VCC and GND
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
SC70–5/SC–88A/SOT–353 (Note 1)
SOT23–5/TSOP–5/SC59–5
–0.5 to +7.0
–0.5 to +7.0
–0.5 to VCC +0.5
–20
+25
*65 to )150
260
)150
350
230
V
V
V
mA
mA
°C
°C
°C
°C/W
PD
Power Dissipation in Still Air at 85°C
SC70–5/SC–88A/SOT–353
150
mW
SOT23–5/TSOP–5/SC59–5
200
MSL
Moisture Sensitivity
Level 1
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34
UL 94 V–0 @ 0.125 in
Human Body Model (Note 2)
u2000
V
Machine Model (Note 3)
u200
Charged Device Model (Note 4)
N/A
ILATCH–UP Latch–Up Performance
Above VCC and Below GND at 125°C (Note 5)
$500
mA
Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 2–ounce copper trace with no air flow.
2. Tested to EIA/JESD22–A114–A.
3. Tested to EIA/JESD22–A115–A.
4. Tested to JESD22–C101–A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
VCC
DC Supply Voltage
VIN
DC Input Voltage
VIS
DC Output Voltage
TA
Operating Temperature Range
tr , tf
Input Rise and Fall Time
ON/OFF Control Input
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
Min
2.0
GND
GND
–55
0
0
Max
5.5
5.5
VCC
+125
100
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
2/8

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