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IXGH32N60B Ver la hoja de datos (PDF) - IXYS CORPORATION

Número de pieza
componentes Descripción
Fabricante
IXGH32N60B
IXYS
IXYS CORPORATION IXYS
IXGH32N60B Datasheet PDF : 5 Pages
1 2 3 4 5
HiPerFASTTM IGBT
IXGH 32N60B
IXGT 32N60B
IXGH 32N60BD1
IXGT 32N60BD1
VCES
I
C25
VCE(sat)
tfi(typ)
= 600 V
= 60 A
= 2.3 V
= 85 ns
(D1)
Symbol
Test Conditions
VCES
VCGR
VGES
V
GEM
IC25
IC90
ICM
SSOA
(RBSOA)
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGE = 1 M
Continuous
Transient
TC = 25°C
TC = 90°C
TC = 25°C, 1 ms
VGE= 15 V, TVJ = 125°C, RG = 22
Clamped inductive load
PC
TC = 25°C
T
J
TJM
T
stg
Md
Mounting torque (M3) TO-247AD
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Weight
TO-247AD
TO-268
Maximum Ratings
600
V
600
V
±20
V
±30
V
60
A
32
A
120
A
ICM = 64
A
@ 0.8 VCES
200
W
-55 ... +150
°C
150
°C
-55 ... +150
°C
1.13/10 Nm/lb.in.
300
°C
6
g
4
g
Symbol
BVCES
V
GE(th)
ICES
IGES
VCE(sat)
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
IC = 250 µA, VGE = 0 V
I
C
=
250
µA,
V
CE
=
V
GE
VCE = 0.8 • VCES
VGE = 0 V
TJ = 25°C
TJ = 150°C
VCE = 0 V, VGE = ±20 V
IC = IC90, VGE = 15 V
600
2.5
32N60B
32N60BD1
V
5.0 V
200 µA
1 mA
3 mA
±100 nA
2.3 V
TO-268
(IXGT)
G
E
TO-247 AD
(IXGH)
C
(TAB)
G
CE
C
(TAB)
G = Gate,
C = Collector,
E = Emitter,
TAB = Collector
Features
Internationalstandardpackages
High frequency IGBT and antiparallel
FRED in one package
Highcurrenthandlingcapability
HiPerFASTTM HDMOSTM process
MOS Gate turn-on
-drive simplicity
Applications
Uninterruptible power supplies (UPS)
Switched-mode and resonant-mode
power supplies
AC motor speed control
DC servo and robot drives
DC choppers
Advantages
Space savings (two devices in one
package)
High power density
Suitableforsurfacemounting
Very low switching losses for high
frequency applications
Easy to mount with 1 screw,TO-247
(insulated mounting screw hole)
© 2003 IXYS All rights reserved
DS98749C(02/03)

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