10B1 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

10B1

Bidirectional Transil™ array for data line protection

STMicroelectronics 

ITAxxB1

4

Package information

Package information

● Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 4. SO-8 dimensions

ccc C

b

C

(Seating

Plane)

C

k

A2 A

e

A1

h x 45°

0.25mm

(Gage Plane)

L

L1

D

8

5

E1

E

1

4

Dimensions

Ref.

Millimeters

Inches

Min. Typ. Max. Min. Typ. Max.

A

1.75

0.069

A1 0.1

A2 1.25

b 0.28

0.25 0.004

0.049

0.48 0.011

0.010

0.019

C 0.17

0.23 0.007

0.009

D 4.80 4.90 5.00 0.189 0.193 0.197

E 5.80 6.00 6.20 0.228 0.236 0.244

E1 3.80 3.90 4.00 0.150 0.154 0.157

e

1.27

0.050

h 0.25

0.50 0.010

0.020

L 0.40

1.27 0.016

0.050

L1

1.04

0.041

k° 0

8

0

8

ccc

0.10

0.004

Figure 10. SO-8 footprint (dimensions in mm)

6.7

0.54

4.03

1.27

1.335

5/7

Share Link: