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ILX558K Ver la hoja de datos (PDF) - Sony Semiconductor

Número de pieza
componentes Descripción
Fabricante
ILX558K Datasheet PDF : 11 Pages
First Prev 11
Package Outline
Unit: mm
6.22 ± 0.3
22
32.0 ± 0.3
22Pin DIP( 400mil )
21.360 ( 5340Pixels )
12
V
H
No. 1Pixel ( GreenMain )
1
11
( 2.9 )
2.54
PACKAGE STRUCTURE
PACKAGE MATERIAL
Plastic
LEAD TREATMENT
GOLD PLATING
LEAD MATERIAL
42 ALLOY
PACKAGE MASS
DRAWING NUMBER
2.21g
LS-D19(E)
0.51
0.3 M
1. The height from the bottom to the sensor surface is 1.61 ± 0.3mm.
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.

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