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IDT723673L15PF

CMOS SyncFIFO™ WITH BUS-MATCHING 2,048 x 36 4,096 x 36 8,192 x 36

Integrated Device Technology 

IDT723653/723663/723673 CMOS SyncFIFOTM WITH BUS-MATCHING

2,048 x 36 x 2, 4,096 x 36 x 2 and 8,192 x 36 x 2

COMMERCIAL TEMPERATURE RANGE

TIMING REQUIREMENTS OVER RECOMMENDED RANGES OF SUPPLY

VOLTAGE AND OPERATING FREE-AIR TEMPERATURE

(Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C)

Commercial

IDT723653L12 IDT723653L15

IDT723663L12 IDT723663L15

IDT723673L12 IDT723673L15

Symbol

Parameter

Min. Max. Min. Max. Unit

fS

Clock Frequency, CLKA or CLKB

—

83

— 66.7 MHz

tCLK

Clock Cycle Time, CLKA or CLKB

12

—

15

—

ns

tCLKH

Pulse Duration, CLKA or CLKB HIGH

5

—

6

—

ns

tCLKL

Pulse Duration, CLKA and CLKB LOW

5

—

6

—

ns

tDS

Setup Time, A0-A35 before CLKA↑ and B0-B35 before CLKB↑

tENS1

Setup Time, CSA and W/RA before CLKA↑; CSB and W/RB before CLKB↑

3

—

4

—

ns

4

—

4.5 —

ns

tENS2

tRSTS

tFSS

tBES

Setup Time, ENA, and MBA before CLKA↑; ENB and MBB before CLKB↑

Setup Time, RS1 or PRS LOW before CLKA↑ or CLKB↑(1)

Setup Time, FS0, FS1 and FS2 before RS1 HIGH

Setup Time, BE/FWFT before RS1 HIGH

3

—

4.5 —

ns

5

—

5

—

ns

7.5

—

7.5 —

ns

7.5

—

7.5 —

ns

tSDS

tSENS

Setup Time, FS0/SD before CLKA↑

Setup Time, FS1/SENbefore CLKA↑

3

—

4

—

ns

3

—

4

—

ns

tFWS

Setup Time, FWFT before CLKA↑

0

—

0

—

ns

tDH

tRTMS

tENH

tRSTH

tFSH

tBEH

Hold Time, A0-A35 after CLKA↑ and B0-B35 after CLKB↑

Setup Time, RTM before RT1; RTM before RT2

Hold Time, CSA, W/RA, ENA, and MBA after CLKA↑; CSB, W/RB, ENB,

and MBB after CLKB↑

Hold Time, RS1 or PRS LOW after CLKA↑ or CLKB↑(1)

Hold Time, FS0, FS1 and FS2 after RS1 HIGH

Hold Time, BE/FWFT after RS1 HIGH

0.5

—

1

—

ns

5

—

5

—

ns

0.5

—

1

—

ns

4

—

4

—

ns

2

—

2

—

ns

2

—

2

—

ns

tSDH

Hold Time, FS0/SD after CLKA↑

0.5

—

1

—

ns

tSENH

Hold Time, FS1/SEN HIGH after CLKA↑

0.5

—

1

—

ns

tSPH

Hold Time, FS1/SEN HIGH after RS1 HIGH

2

—

2

—

ns

tRTMH Hold Time, RTM after RT1; RTM after RT2

5

—

5

—

ns

tSKEW1(2) Skew Time between CLKA↑ and CLKB↑ for EF/OR and FF/IR

5

—

7.5 —

ns

tSKEW2(2,3) Skew Time between CLKA↑ and CLKB↑ for AE and AF

12

—

12

—

ns

NOTES:

1. Requirement to count the clock edge as one of at least four needed to reset a FIFO.

2. Skew time is not a timing constraint for proper device operation and is only included to illustrate the timing relationship between CLKA cycle and CLKB cycle.

3. Design simulated, not tested.

4. Industrial temperature range is available by special order.

8

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